2010.11.242[Wed]-26[Fri]10:00-17:00 Tokyo Big Sight
RT, UT, ET, MT, PT, SM, AE, VT, Laser, Infrared etc.
measurement/sizing (length, thickness, width), material evaluation (discrimination, electric conductivity, extraneous material, hardness, degree of hardening, poor weld, poor adhesion, elastic modulus easurement), dent (cracks, lamination, void, hollow), others (contamination detection, inclusion etection, publication, information etc.
• Processing and/or manufacturing companies of Automobile, electronics, semiconductors, food, medical related products, heavy industries, industry, civil construction, aerospace instruments, vehicles, ships and vessels, tools and dies etc.
• Manufacturers of materials such as iron, refining, metal. non-metal, glass, plastic, ceramics etc. (in terms of material inspection)
• Power related entities: electric power generating, retailing, chemical/fuel/nuclear power plants
• Research Centers, Examination Facilities, Academic Institutions (Universities, Colleges) etc.
* Due to the concurrent convening of multiple related shows, a spillover effect of visitors from these fields can be expected. (concurrently held with joint admission)
We compared and reviewed the newest inspection systems. We asked several companies for estimates of the cost of future adoption.
Quality assurance division chief, attendee
We were able to find technologies that could be applied to a new product. We will plan on visiting the research institution soon.
Manufacturer board member, attendee
We received more inquiries than we had expected. Many users were looking for solutions and we were able to pitch our proposals and discuss business matters with them.
Sales division chief, exhibitor
As attendees from concurrent shows were able to attend freely, we had many of them visit our section. We received contacts and inquiries from attending businesses we previously had no contact with.
CEO, exhibitor
* This image is from the 2009 fair